PCI BUSPCI Bus {The Peripheral Component Interface 'PCI' [Parallel] Bus was originally developed as a local bus expansion for the PC. The first version of the PCI bus ran at 33MHz with a 32 bit bus (133MBps), the current version runs at 66MHz with a 64 bit bus. The PCI bus operates either synchronously or asynchronously with the "mother Board bus rate: The page contains the PCI connector Pin-Outs}
PCI-X BUS
PCI-X Bus {The Peripheral Component Interface [PCI-X] addendum is an enhancement to the current 64 bit 66MHz PCI bus specification. The minimum clock speed for PCI-X is 66MHz [PCI-X 66]. Additional bus speeds include: PCI-X 133, PCI-X 266 and PCI-X 533 providing up to 4.3GBps [PCI-X 1066 in the works]. PCI-X is backwards compatible with PCI. I believe the X stands for extension}
ONE SET OF PCI Express BUS
PCI Express Bus {Serial PCI Bus uses two low-voltage differential LVDS pairs, at 2.5Gb/s in each direction. Using 8B/10B encoding, and Supporting 1x, 2x, 4x, 8x, 12x, 16x, 32x bus widths. Set to replace the Parallel PCI bus; PCI, and PCI-X. PCIe is currently replacing the AGP slot on PC Mother Boards.}
PCI-ISA BUS
PCI-ISA {A passive backplane which moves all active devices off the motherboard and onto a single card. The controller card used in the system has fingers [edge connectors] for both PCI and the ISA bus, the Mother Board only connectors. This allows additional cards to be added to the mother board which use either the ISA or PCI buses. Because only connectors reside on the mother board, repair time is increased, and down time is decreased. The standard is PICMG 1.0. The specification is used in embedded or industrial computer systems. A similar standard is PISA listed below. A newer standard called ePCI-X removes the obsolete ISA bus and replaces it with PCI-X interfaces.}
COOLING SYSTEM
Apparatus employed to keep the temperature of a structure or device from exceeding limits imposed by needs of safety and efficiency. If overheated, the oil in a mechanical transmission loses its lubricating capacity, while the fluid in a hydraulic coupling or converter leaks under the pressure created. In an electric motor, overheating causes deterioration of the insulation. The pistons in an overheated internal-combustion engine may seize (stick) in the cylinders. Cooling systems are employed in automobiles, industrial plant machinery, nuclear reactors, and many other types of machinery.
CASING SYSTEM
Most folks who have been around computers for any length of time know the name Antec. These folks have been around since 1986 and since that time created a solid image of a company whose goal is to make high quality components for the DIY crowd.While they have delved in several niche markets in that time, their reputation for making high quality power supplies and enclosures is practically legendary.Enter the newest product to fall into their prestigious "Performance One" series category, the P190. While based somewhat on the tried and true P180 enclosure, it weighs in with not only a hefty feature set, but a price tag to match. Our goal today is to help you determine if the high price is worth what is being offered.So, kick back and settle in as we tear into one of the most feature-rich enclosure computer cases available on the market today!
LGA PROCESSOR
FC-LGA4 Package Type
The FC-LGA4 package is used with Pentium® 4 processors designed for the LGA775 socket. FC-LGA4 is short for Flip Chip Land Grid Array 4. FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the LAND contacts. LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number 4 stands for the revision number of the package.This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heatsink.You may also see references to processors in the 775-LAND package. This refers to the number of contacts that the new package contains that interface with the LGA775 socket.
PGA PROCESSOR
LGA Package Type
The FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processors, which use 370 pins.
